NETWORK Technology
GSM / HSPA / LTE
BODY Dimensions 163.5 x 76.5 x 9 mm (6.44 x 3.01 x 0.35 in)
Weight 197 g (6.95 oz)
SIM Dual SIM (Nano-SIM, dual stand-by)
DISPLAY Type IPS LCD
Size 6.63 inches, 106.1 cm2 (~84.8% screen-to-body ratio)
Resolution 1080 x 2400 pixels, 20:9 ratio (~397 ppi density)
PLATFORM OS Android 10, EMUI 10.1, no Google Play Services
Chipset Mediatek Helio G80 (12 nm)
CPU Octa-core (2×2.0 GHz Cortex-A75 & 6×1.8 GHz Cortex-A55)
GPU Mali-G52 MC2
MEMORY Card slot NM (Nano Memory), (uses shared SIM slot)
Internal128GB 8GB RAM
UFS 2.1
MAIN CAMERA Quad 64 MP, f/1.8, 26mm (wide), 1/1.73″, 0.8µm, PDAF
8 MP, f/2.4, 120˚ (ultrawide)
2 MP, f/2.4, (macro)
2 MP, f/2.4, (depth)
Features Quad-LED flash, HDR, panorama
Video 4K@30fps, 1080p@30fps, gyro-EIS
SELFIE CAMERA Single Motorized pop-up 16 MP, f/2.2, (wide), 1/3.1″, 1.0µm
Features HDR
Video 1080p@30fps
SOUND Loudspeaker Yes
3.5mm jack Yes
COMMS WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band, Wi-Fi Direct, hotspot
Bluetooth 5.1, A2DP, LE
GPS Yes, with A-GPS, GLONASS, BDS
NFC No
Radio No
USB USB Type-C 2.0, USB On-The-Go
FEATURES Sensors Fingerprint (side-mounted), accelerometer, gyro, proximity, compass
BATTERY Type Li-Po 4200 mAh or 4300 mAh, non-removable (region dependent)
Charging Fast charging 22.5W or 40W (region dependent)
Weight | 0.19 kg |
---|---|
Dimensions | 16.52 × 7.55 × 0.89 cm |
Brand | |
Location | Shipped from Ghana |
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Industrial Tools & Equipments, Power & Hand Tools
Mitre Saw INGCO BMIS16002
Key Features.
● Type: Industrial
● Voltage: 220-240V~50Hz
● Input power: 1600W
● No-load speed: 2800rpm
● Blade size: 305mm x 30mm
● Max. cutting capacity: 60x185mm
● Mitre cuts 0-45°left and right
● Bevel cuts up to 45°to the leftSKU: BA21E836871
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